NURHAYATI, N.; LINDA, R.; ANWAR, L. E-module Using FlipHTML5 Application on Chemical Bond Material. Jurnal Pendidikan Kimia Indonesia, [S. l.], v. 6, n. 2, p. 133–141, 2022. DOI: 10.23887/jpki.v6i2.49542. Disponível em: https://ejournal.undiksha.ac.id/index.php/JPK/article/view/49542. Acesso em: 28 apr. 2024.